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With 14,000 employees in 30 countries and sales of 1.28 billion euros in 2010, FCI is a leading manufacturer of connectors for various markets such as telecommunication and datacom infrastructures as well as consumer, industrial, instrumentation and medical electronics.

FCI designs and manufactures a multitude of products ranging from the most basic to the most complex, like the smart or high speed and density connectors.

FCI introduces a new 1.25mm Wire-to-Board Connector System

FCI, a leading supplier of connectors and interconnect systems, has developed a 1.25mm wire-to-board connector system that is designed for a wide range of demanding applications such as industrial control, automotive telematics, (home) security systems and much more.

Click here for more information.

FCI: Next Generation SAS Storage Interface

The Mini-SAS HD product portfolio is the next generation SAS based storage I/O System that allows for the signal transmission of both SAS 2.1 (6 Gb/s per channel) and the proposed SAS 3.0 (12Gb/s per channel) industry standard protocols.

23.01.2012 - FCI: The miniaturization trend within 'demanding' Wire-to-Board applications

FCI 1.25mm Wire-to-Board Connector System

As packaged electronics becomes smaller, interconnect suppliers generally responded by introducing smaller pitch product ranges. This trend towards miniaturization is specifically strong for board to board connections in ‘demanding applications’ in the Industrial, Instrumentation and Medical markets.

New Products, FCI, Connectors, Automotive & Transportation, Building Automation, Heating, Ventilation, Air Conditioning, Industrial Automation, Lighting & Signage, Medical & Healthcare, Networking & Communication, Point of Sales, Renewable Energy, Security & Access Control, Smart Energy, White Goods

Arrow Multisolution Day

Arrow Iberia Electrónica is pleased to invite you to the second edition of Arrow Multisolution Day.

Spain, Bilbao 19.06.2012 (09:00 - 18:00)

Events, Spain, Altera, Analog Devices, Atmel, Avago Technologies, Cree, Fairchild Semiconductor, Freescale, IDT, Infineon, Intel, International Rectifer, Linear Technology, NXP Semiconductors, Osram, Renesas, STMicroelectronics, Taiwan Semiconductors, Telit, Texas Instruments, Vishay, Amphenol, Bourns, Cooper Bussman, C&K, FCI, Honeywell, Kemet, Knitter-Switch, Molex, Recom, Samtec, TE Connectivity, Vicor, Microsoft Windows Embedded Partner

Customer Supplier Day 2012

We hereby would like to invite you to attend our Customer Supplier Day 2012. This exhibition and seminar day is organized in association with several suppliers.

Houten 23.05.2012 (10:00 - 19:00)

Events, Austria, Belgium, Germany, Luxembourg, Netherlands, Switzerland, Altera, Analog Devices, ASSMANN, Avago Technologies, AVX, Bourns, Cree, Crydom, Epcos, Fairchild Semiconductor, FCI, Freescale, Infineon, International Rectifer, Kemet, Ledil, Linear Technology, 3M, Molex, NXP Semiconductors, ON Semiconductor, Osram, Phoenix Contact, Recom, Renesas, Samtec, Sharp, STMicroelectronics, Texas Instruments, TE Connectivity, Everlight, Knitter-Switch, Precidip, Radiall, Schroff, Spansion

Arrow Global Village 2012

Arrow invites all his customers to the third Arrow Global Village, which will take place in Helsinki on 24 May 2012.

Finland: Helsinki 24.05.2012 (09:00 - 17:00)

Events, Finland, 3M, Analog Devices, Atmel, Avago Technologies, Bourns, Epcos, FCI, Freescale, Infineon, Intel, International Rectifer, Kemet, Kontron, Microsoft Windows Embedded Partner, Molex, NXP Semiconductors, Osram, Phoenix Contact, STMicroelectronics, TE Connectivity, Texas Instruments, Varta, Vishay

NPI

New Product Introduction (NPI)

Product	Samples	Description
	Sample request	8 port shielded modular Jack Operating temperature: 0°C~70°C Storage temperature: -40°C~85°C Dip Modular Jack Low Profile Durability: 1,000 cycles Optional Plating type: AU-flash, 6µ", 15µ", 30µ" and 50µ" AU-plating RoHS comliant Tab down Tray packaging Shield shell for EMI protection www.fciconnect.com/modjacks
	Sample request	High Power Card Edge Surface Mount Current rating to 9A/power contact beam (with multiple power con- tacts fully energized) without exceeding a 30°C temperature rise in still air Low profile height (2.8 mm for straddle mount; 7.50 mm for right angle) maximizes airflow for effective system cooling One-piece assembly enables cost-effective power delivery for 1U and 2U power supplies or power distribution applications Vertical, right angle and straddle mount options are available with both power contacts for power distribution and signal contacts for power control Number and placement of power and signal contacts are highly configurable for custom power needs Polarized housing option ensures proper mating board orientation Plastic housing features and mounting ear options are available for polarization to the host PCB as well as to secure the connector during the wave solder www.fciconnect.com/hpce
	Sample request	Minitek 2.00mm pitch Surface Mount Horizontal Header Available up to 25 Pins Per Row Single and Double Row Tin and Selective Gold High Temperature housing Coplanarity 0.1mm Mates with standard Minitek Receptacles www.fciconnect.com/minitek
	Sample request	1.25mm Wire-to-Board System Temperature withstand 105°C for 96 hours. Plating type： AU-flash or Matt-Tin Current rating: 1 Amp (0.8 A --32 AWG) Durability: 30 cycles 8 Straight/vertical SMT/through hole options LCP plastic used in the header meets HF requirement Housing meets IEC 60695-2 glowing/hot-wire test UL approved Available up to 15 positions www.fciconnect.com/boardwiresystems
	Sample request	Small Cube Form Factor Transceiver (SCFF) 11pin electrical interface Complies with 2G/4G/8G FibreChannel specifications Digital diagnostic through 2 wire serial interface (SFP+ compatible) SFP+ compatible SFI high speed electrical interface Low power consumption at <0.6W Transmission of up to 150m over OM3 multi-mode fiber at 8G FC 0°C to +70°C case operating temperature 850nm VCSEL laser Duplex LC connector SCFF is UL certified for use in Low Power Systems (LPS). www.fciconnect.com/hsio
	Sample request	XCede High Speed Backpanel High-speed backplane system capable of 25 Gb/s Use of engineering materials in the shield aids in reduction of crosstalk resonances 1.85 mm column pitch offers high linear signal density Configurations with 6 differential pairs/column fit 36 mm card slot pitch and provide 82.4 pairs/inch 4 pairs/column fit 25 mm slot pitch with 54.9 pairs/inch 2 pairs/column fit 15 mm slot pitch with 27.5 pairs/inch Two ground vias between differential pairs allow elongated antipads to further improve impedance. Optional short compliant pin permits deeper backdrilling and dual diameter vias to enhance return loss performance Wide ground contacts feature a stiffening rib and are advanced well ahead of signals for exceptional robustness and signal pin protection Intermateable, electrically and mechanically interchangeable licensed second source to Amphenol TCS www.fciconnect.com/xcede
	Sample request	Terminal Blocks Robust and solid design Modular system, 2 up to 24 positions Pitch-sizes: 3.50mm, 3.81mm, 5.00mm, 5.08mm, 7.62mm and 10.16mm Signal and Power, current ratings from 32A up to 55A Various product configurations Locking flange feature Latching feature, prevent miss-match End-to-end stackable Through mount soldering High performance rising-cage-clamp contact system and spring-clamp-contact Recognized High durability, 200 mating cycles 3D models (IGES and STEPS) available Product and Partnumber Selector www.fciconnect.com/terminalblocks

Markets & Applications

FCI Electronics designs and manufacture a very wide range of interconnect solutions for a variety of applications and markets.
By clicking on the icon or text below, you will be guided into the predefined applications and connector product options.

Applications:

Data market